EP0270954B1 - Chip-type fuse - Google Patents

Chip-type fuse Download PDF

Info

Publication number
EP0270954B1
EP0270954B1 EP87117577A EP87117577A EP0270954B1 EP 0270954 B1 EP0270954 B1 EP 0270954B1 EP 87117577 A EP87117577 A EP 87117577A EP 87117577 A EP87117577 A EP 87117577A EP 0270954 B1 EP0270954 B1 EP 0270954B1
Authority
EP
European Patent Office
Prior art keywords
chip
fuse
conducting member
insulating member
protecting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
EP87117577A
Other languages
German (de)
French (fr)
Other versions
EP0270954A1 (en
Inventor
Satoru Shimokawa
Hideaki Hattan
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Omron Corp
Original Assignee
Omron Tateisi Electronics Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Omron Tateisi Electronics Co filed Critical Omron Tateisi Electronics Co
Priority to AT87117577T priority Critical patent/ATE89435T1/en
Publication of EP0270954A1 publication Critical patent/EP0270954A1/en
Application granted granted Critical
Publication of EP0270954B1 publication Critical patent/EP0270954B1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
    • H01H85/02—Details
    • H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
    • H01H85/041—Fuses, i.e. expendable parts of the protective device, e.g. cartridges characterised by the type
    • H01H85/046—Fuses formed as printed circuits

Definitions

  • This invention relates to a chip-type fuse for interrupting overcurrents which damage electronic parts mounted on a printed circuit board (PCB), and more particularly, to an improved chip-type fuse which is inexpensive and can be easily automatically mounted on a PCB.
  • PCB printed circuit board
  • a fuse is used to interrupt overcurrents which damage electronic parts mounted on a PCB.
  • chip-type fuses which are mounted on a PCB have been developed in recent years.
  • One of the conventional chip-type fuses includes an insulating substrate and a conductor.
  • the insulating substrate has two electrodes disposed thereon, and the conductor electrically connects the two electrodes to each other.
  • the conductor is made of thin-film metal and disposed in a recess formed on the lower surface of the substrate.
  • Another conventional chip-type fuse includes an insulating substrate having a pair of electrodes, a gold (Au) wire wire-bonded to the electrodes, and a resin which is disposed on the substrate to seal the gold wire.
  • the conventional fuses are very expensive because the recess for housing the conductor must be formed or the wire must be wire-bonded to the electrodes. In addition, the conventional fuses have so complicated shapes that they can not easily be automatically mounted on a PCB.
  • a circuit fuse assembly comprising a plurality of fuse elements.
  • the plurality of fuse elements is simultaneously formed using printed circuit or through hole plating techniques and includes means for easily substituting a different one of the fuse elements when the in-circuit fuse element burns out due to an overload current condition.
  • a fuse circuit for high frequency applications comprising a metal conductor disposed on a support element which is constituted of ceramic.
  • DE-A-2845540 discloses a heat resistant coating material for electrical resistors.
  • the coating material is composed of a mixture of silicone resin and epoxy resin to provide an inflammable coating for electrical components.
  • Figs. 1 shows a chip-type fuse according to an embodiment of the invention.
  • a chip-type fuse 1 includes a ceramic substrate 2 as an insulating substrate which is rectangular like a rectangular chip-type resistor and whose size is 3.2mm x 1.6mm.
  • a conducting member 3 made of thin-film metal which is deposited or printed on upper surface 2a.
  • Conducting member 3 can be made of a silver-palladium (Pd) alloy, silver-platinum (Pt) alloy, silver, copper, or gold.
  • Electrodes 4a and 4b are formed on side ends 2b and 2c of substrate 2, respectively. Electrodes 4a and 4b are made of thin-film metal which is deposited on side ends 2b and 2c or disposed theron with other known methods.
  • Conducting member 3 is a rectangular parallelepiped and both ends of the conducting member 3 are connected to electrodes 4a and 4b, respectively.
  • Upper surface 2a of substrate 2 is coated with a silicone resin film (protecting film) 5 to completely cover conducting member 3.
  • chip-type fuse 1 Since chip-type fuse 1 has the same shape as micro-chip resistors, it can be easily automatically mounted on a PCB to reduce the mounting cost.
  • fuse 1 The operation of fuse 1 is described hereinafter.
  • conducting member 3 If an overcurrent flows through fuse 1, conducting member 3 is melted and broken somewhere between the ends to interrupt the overcurrent. Since conducting member 3 is covered with silicone resin film 5, metal vapor generated at the melted portion are prevented from scattering outside fuse 1. Moreover, arc discharge caused by the metal vapor is prevented from continuing because the silicone resin functions as an arc-extinguishing medium, completely protecting the electronic parts. In addition, since conducting member 3 is formed directly on upper surface 2a of substrate 2, it has a high heat-radiating effect to allow flows of high-level currents despite the small size of fuse 1.
  • conducting member 3 is not made of a golden wire unlike the conventional chip-type fuse, conducting member 3 is hardly broken, easy to handle, and highly heat-resistant.
  • Fig. 2 shows a plan view of the chip-type fuse according the invention.
  • Conducting member 3 has trimmed portions 3b which are trimmed with laser light to obtain appropriate resistance.
  • chip-type fuse 1 The operation of chip-type fuse 1 is described hereinafter.
  • fuse 1 If an overcurrent flows through fuse 1, one of trimmed portions 3b is melted and broken to interrupt the overcurrent. The reliability of fuse 1 increases because trimmed portions 3b are easily melted and broken by an overcurrent.
  • the conducting member 3 is rectangular it can have another shape.
  • the protecting film 5 can be made of a glass material.

Abstract

A chip-type fuse (1) which includes an insulating member (2), a pair of electrode members (4a, 4b) disposed on the insulating member, a conducting member (3) for electrically connecting the pair of electrode members to each other, and a protecting member (5) disposed on the insulating member for protecting the conducting member. The conducting member is deposited or printed on the insulating member. The insulating member is made rectangular so that it can be easily automatically mounted on a printed circuit board.

Description

  • This invention relates to a chip-type fuse for interrupting overcurrents which damage electronic parts mounted on a printed circuit board (PCB), and more particularly, to an improved chip-type fuse which is inexpensive and can be easily automatically mounted on a PCB.
  • Generally, a fuse is used to interrupt overcurrents which damage electronic parts mounted on a PCB. For that purpose, chip-type fuses which are mounted on a PCB have been developed in recent years.
  • One of the conventional chip-type fuses includes an insulating substrate and a conductor. The insulating substrate has two electrodes disposed thereon, and the conductor electrically connects the two electrodes to each other. The conductor is made of thin-film metal and disposed in a recess formed on the lower surface of the substrate.
  • Another conventional chip-type fuse includes an insulating substrate having a pair of electrodes, a gold (Au) wire wire-bonded to the electrodes, and a resin which is disposed on the substrate to seal the gold wire.
  • The conventional fuses are very expensive because the recess for housing the conductor must be formed or the wire must be wire-bonded to the electrodes. In addition, the conventional fuses have so complicated shapes that they can not easily be automatically mounted on a PCB.
  • From WO 87/01331, a circuit fuse assembly, comprising a plurality of fuse elements, is known. The plurality of fuse elements is simultaneously formed using printed circuit or through hole plating techniques and includes means for easily substituting a different one of the fuse elements when the in-circuit fuse element burns out due to an overload current condition.
  • From FR-A-901549, a fuse circuit for high frequency applications is known, comprising a metal conductor disposed on a support element which is constituted of ceramic.
  • DE-A-2845540 discloses a heat resistant coating material for electrical resistors. The coating material is composed of a mixture of silicone resin and epoxy resin to provide an inflammable coating for electrical components.
  • It is the object of this invention to provide a chip-type fuse which can be produced at low cost.
  • It is another object of this invention to provide a chip-type fuse which can be easily automatically mounted on a PCB.
  • According to this invention, there is provided a chip-type fuse comprising the features of claim 1.
  • The above and other objects, advantages and features of this invention will be more fully understood when considered in conjunction with the following figures, of which:
    • Fig.1 is a sectional view of an embodiment of the invention;
    • and Fig.2 is a plan view of the embodiment of the invention.
  • Figs. 1 shows a chip-type fuse according to an embodiment of the invention.
  • A chip-type fuse 1 includes a ceramic substrate 2 as an insulating substrate which is rectangular like a rectangular chip-type resistor and whose size is 3.2mm x 1.6mm. Formed on an upper surface of ceramic substrate 2 is a conducting member 3 made of thin-film metal which is deposited or printed on upper surface 2a. Conducting member 3 can be made of a silver-palladium (Pd) alloy, silver-platinum (Pt) alloy, silver, copper, or gold. Electrodes 4a and 4b are formed on side ends 2b and 2c of substrate 2, respectively. Electrodes 4a and 4b are made of thin-film metal which is deposited on side ends 2b and 2c or disposed theron with other known methods. Conducting member 3 is a rectangular parallelepiped and both ends of the conducting member 3 are connected to electrodes 4a and 4b, respectively. Upper surface 2a of substrate 2 is coated with a silicone resin film (protecting film) 5 to completely cover conducting member 3.
  • Since chip-type fuse 1 has the same shape as micro-chip resistors, it can be easily automatically mounted on a PCB to reduce the mounting cost.
  • The operation of fuse 1 is described hereinafter.
  • If an overcurrent flows through fuse 1, conducting member 3 is melted and broken somewhere between the ends to interrupt the overcurrent. Since conducting member 3 is covered with silicone resin film 5, metal vapor generated at the melted portion are prevented from scattering outside fuse 1. Moreover, arc discharge caused by the metal vapor is prevented from continuing because the silicone resin functions as an arc-extinguishing medium, completely protecting the electronic parts. In addition, since conducting member 3 is formed directly on upper surface 2a of substrate 2, it has a high heat-radiating effect to allow flows of high-level currents despite the small size of fuse 1.
  • On the other hand, since conducting member 3 is not made of a golden wire unlike the conventional chip-type fuse, conducting member 3 is hardly broken, easy to handle, and highly heat-resistant.
  • Fig. 2 shows a plan view of the chip-type fuse according the invention.
  • Side ends 2b of the substrate 2 in the longitudinal direction respectively have semicircular holes 12c which extend through in height.
  • Conducting member 3 has trimmed portions 3b which are trimmed with laser light to obtain appropriate resistance.
  • The operation of chip-type fuse 1 is described hereinafter.
  • If an overcurrent flows through fuse 1, one of trimmed portions 3b is melted and broken to interrupt the overcurrent. The reliability of fuse 1 increases because trimmed portions 3b are easily melted and broken by an overcurrent.
  • Although the conducting member 3 is rectangular it can have another shape. Moreover, the protecting film 5 can be made of a glass material.
  • The above description and the accompanying drawings are merely illustrative of the application of the principles of the present invention and are not limiting. Numerous other arrangement which employ the principles of the invention and which fall within the scope may be readily devised by those skilled in the art. Accordingly, the invention is not limited by the foregoing description, but only limited by the scope of the appended claims.

Claims (4)

  1. A chip-type fuse (1) comprising:
    an insulating member (2);
    a pair of electrode members (4a, 4b) which are made of thin-film metal and disposed on the side ends (2b, 2c) of said insulating member (2);
    a conducting member (3), which is formed on the upper surface (2a) of said insulating member (2), electrically connecting said pair of electrode members (4a, 4b) to each other;
    the conducting member (3) includes a plurality of trimmed portions (3b); and
    a protecting member (5) disposed on said insulating member (2) for protecting said conducting member (3),
    characterized in that
    the plurality of trimmed portions (3b) of the conducting member (3) are connected in series.
  2. The fuse according to claim 1, wherein the insulating member (2) is a rectangular ceramic parallelepiped.
  3. The fuse according to claim 1, wherein the protecting member (5) is made of a silicone resin material.
  4. The fuse according to claim 1, wherein the protecting member (5) is made of a glass material.
EP87117577A 1986-12-01 1987-11-27 Chip-type fuse Expired - Lifetime EP0270954B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AT87117577T ATE89435T1 (en) 1986-12-01 1987-11-27 CHIP SECURITY.

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP61287081A JPH0831303B2 (en) 1986-12-01 1986-12-01 Chip type fuse
JP287081/86 1986-12-01

Publications (2)

Publication Number Publication Date
EP0270954A1 EP0270954A1 (en) 1988-06-15
EP0270954B1 true EP0270954B1 (en) 1993-05-12

Family

ID=17712806

Family Applications (1)

Application Number Title Priority Date Filing Date
EP87117577A Expired - Lifetime EP0270954B1 (en) 1986-12-01 1987-11-27 Chip-type fuse

Country Status (5)

Country Link
EP (1) EP0270954B1 (en)
JP (1) JPH0831303B2 (en)
AT (1) ATE89435T1 (en)
DE (1) DE3785835T2 (en)
ES (1) ES2046194T3 (en)

Cited By (13)

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Publication number Priority date Publication date Assignee Title
US7983024B2 (en) 2007-04-24 2011-07-19 Littelfuse, Inc. Fuse card system for automotive circuit protection
US8075872B2 (en) 2003-08-06 2011-12-13 Gruenenthal Gmbh Abuse-proofed dosage form
US8114384B2 (en) 2004-07-01 2012-02-14 Gruenenthal Gmbh Process for the production of an abuse-proofed solid dosage form
US8309060B2 (en) 2003-08-06 2012-11-13 Grunenthal Gmbh Abuse-proofed dosage form
US8383152B2 (en) 2008-01-25 2013-02-26 Gruenenthal Gmbh Pharmaceutical dosage form
US8722086B2 (en) 2007-03-07 2014-05-13 Gruenenthal Gmbh Dosage form with impeded abuse
US9161917B2 (en) 2008-05-09 2015-10-20 Grünenthal GmbH Process for the preparation of a solid dosage form, in particular a tablet, for pharmaceutical use and process for the preparation of a precursor for a solid dosage form, in particular a tablet
US9629807B2 (en) 2003-08-06 2017-04-25 Grünenthal GmbH Abuse-proofed dosage form
US9636303B2 (en) 2010-09-02 2017-05-02 Gruenenthal Gmbh Tamper resistant dosage form comprising an anionic polymer
US9655853B2 (en) 2012-02-28 2017-05-23 Grünenthal GmbH Tamper-resistant dosage form comprising pharmacologically active compound and anionic polymer
US9675610B2 (en) 2002-06-17 2017-06-13 Grünenthal GmbH Abuse-proofed dosage form
US9913814B2 (en) 2014-05-12 2018-03-13 Grünenthal GmbH Tamper resistant immediate release capsule formulation comprising tapentadol
US11844865B2 (en) 2004-07-01 2023-12-19 Grünenthal GmbH Abuse-proofed oral dosage form

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DE10361596A1 (en) 2003-12-24 2005-09-29 Grünenthal GmbH Process for producing an anti-abuse dosage form
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US9190235B2 (en) * 2007-12-29 2015-11-17 Cooper Technologies Company Manufacturability of SMD and through-hole fuses using laser process
JP5270196B2 (en) * 2008-03-07 2013-08-21 三菱電機株式会社 Semiconductor device and inverter system provided with the semiconductor device
RU2555531C2 (en) 2009-07-22 2015-07-10 Грюненталь Гмбх Misuse protected dosage form for oxidation sensitive opioids
KR101738369B1 (en) 2009-07-22 2017-05-22 그뤼넨탈 게엠베하 Hot-melt extruded controlled release dosage form
EP2611426B1 (en) 2010-09-02 2014-06-25 Grünenthal GmbH Tamper resistant dosage form comprising inorganic salt
JP5880648B2 (en) * 2010-09-06 2016-03-09 株式会社村田製作所 Electronic components
JP5810706B2 (en) * 2010-09-06 2015-11-11 株式会社村田製作所 Electronic components
AR087359A1 (en) 2011-07-29 2014-03-19 Gruenenthal Gmbh TEST ALTERATION TABLET PROVIDING IMMEDIATE RELEASE OF THE PHARMACO
EA201400172A1 (en) 2011-07-29 2014-06-30 Грюненталь Гмбх SUSTAINABLE TO DESTRUCTION TABLET THAT PROVIDES IMMEDIATE RELEASE OF MEDICINES
MX362357B (en) 2012-04-18 2019-01-14 Gruenenthal Gmbh Tamper resistant and dose-dumping resistant pharmaceutical dosage form.
US10064945B2 (en) 2012-05-11 2018-09-04 Gruenenthal Gmbh Thermoformed, tamper-resistant pharmaceutical dosage form containing zinc
CN104813433B (en) 2012-09-28 2017-10-24 釜屋电机株式会社 The manufacture method of chip fuse and chip fuse
JP6445537B2 (en) 2013-05-29 2018-12-26 グリュネンタール・ゲゼルシャフト・ミト・ベシュレンクテル・ハフツング Tamper-resistant dosage forms containing one or more particles
AR096439A1 (en) 2013-05-29 2015-12-30 Gruenenthal Gmbh DOSAGE METHOD RESISTING TO INDEED USE CONTAINING ONE OR MORE PARTICLES
EA032465B1 (en) 2013-07-12 2019-05-31 Грюненталь Гмбх Tamper-resistant oral pharmaceutical dosage form containing ethylene-vinyl acetate polymer and process for the production thereof
AU2014356581C1 (en) 2013-11-26 2020-05-28 Grunenthal Gmbh Preparation of a powdery pharmaceutical composition by means of cryo-milling
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EP3285745A1 (en) 2015-04-24 2018-02-28 Grünenthal GmbH Tamper-resistant dosage form with immediate release and resistance against solvent extraction
JP2018526414A (en) 2015-09-10 2018-09-13 グリュネンタール・ゲゼルシャフト・ミト・ベシュレンクテル・ハフツング Protection against oral overdose with abuse-inhibiting immediate release formulations

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Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9675610B2 (en) 2002-06-17 2017-06-13 Grünenthal GmbH Abuse-proofed dosage form
US9629807B2 (en) 2003-08-06 2017-04-25 Grünenthal GmbH Abuse-proofed dosage form
US8075872B2 (en) 2003-08-06 2011-12-13 Gruenenthal Gmbh Abuse-proofed dosage form
US8309060B2 (en) 2003-08-06 2012-11-13 Grunenthal Gmbh Abuse-proofed dosage form
US8420056B2 (en) 2003-08-06 2013-04-16 Grunenthal Gmbh Abuse-proofed dosage form
US8114384B2 (en) 2004-07-01 2012-02-14 Gruenenthal Gmbh Process for the production of an abuse-proofed solid dosage form
US11844865B2 (en) 2004-07-01 2023-12-19 Grünenthal GmbH Abuse-proofed oral dosage form
US8722086B2 (en) 2007-03-07 2014-05-13 Gruenenthal Gmbh Dosage form with impeded abuse
US7983024B2 (en) 2007-04-24 2011-07-19 Littelfuse, Inc. Fuse card system for automotive circuit protection
US8383152B2 (en) 2008-01-25 2013-02-26 Gruenenthal Gmbh Pharmaceutical dosage form
US9161917B2 (en) 2008-05-09 2015-10-20 Grünenthal GmbH Process for the preparation of a solid dosage form, in particular a tablet, for pharmaceutical use and process for the preparation of a precursor for a solid dosage form, in particular a tablet
US9636303B2 (en) 2010-09-02 2017-05-02 Gruenenthal Gmbh Tamper resistant dosage form comprising an anionic polymer
US9655853B2 (en) 2012-02-28 2017-05-23 Grünenthal GmbH Tamper-resistant dosage form comprising pharmacologically active compound and anionic polymer
US9913814B2 (en) 2014-05-12 2018-03-13 Grünenthal GmbH Tamper resistant immediate release capsule formulation comprising tapentadol

Also Published As

Publication number Publication date
DE3785835D1 (en) 1993-06-17
JPS63141233A (en) 1988-06-13
ATE89435T1 (en) 1993-05-15
ES2046194T3 (en) 1994-02-01
JPH0831303B2 (en) 1996-03-27
EP0270954A1 (en) 1988-06-15
DE3785835T2 (en) 1993-08-19

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