EP0270954A1 - Chip-type fuse - Google Patents

Chip-type fuse Download PDF

Info

Publication number
EP0270954A1
EP0270954A1 EP87117577A EP87117577A EP0270954A1 EP 0270954 A1 EP0270954 A1 EP 0270954A1 EP 87117577 A EP87117577 A EP 87117577A EP 87117577 A EP87117577 A EP 87117577A EP 0270954 A1 EP0270954 A1 EP 0270954A1
Authority
EP
European Patent Office
Prior art keywords
fuse
chip
insulating member
protecting
conducting member
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP87117577A
Other languages
German (de)
French (fr)
Other versions
EP0270954B1 (en
Inventor
Satoru Shimokawa
Hideaki Hattan
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Omron Corp
Original Assignee
Omron Tateisi Electronics Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Omron Tateisi Electronics Co filed Critical Omron Tateisi Electronics Co
Priority to AT87117577T priority Critical patent/ATE89435T1/en
Publication of EP0270954A1 publication Critical patent/EP0270954A1/en
Application granted granted Critical
Publication of EP0270954B1 publication Critical patent/EP0270954B1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
    • H01H85/02—Details
    • H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
    • H01H85/041—Fuses, i.e. expendable parts of the protective device, e.g. cartridges characterised by the type
    • H01H85/046—Fuses formed as printed circuits

Definitions

  • This invention relates to a chip-type fuse for interrupting overcurrents which damage electronic parts mounted on a printed circuit board (PCB), and more particularly, to an improved chip-­type fuse which is inexpensive and can be easily automatically monted on a PCB.
  • PCB printed circuit board
  • a fuse is used to inrterrupt overcurrents which damage electronic parts mounted on a PCB.
  • chip-­type fuses which are mounted on a PCB have been developed in recent years.
  • One of the conventional chip-type fuses includes an insulating substrate and a conductor.
  • the insulating substrate has two electrodes disposed thereon, and the conductor electrically connects the two electrodes to each other.
  • the conductor is made of thin-film metal and disposed in a recess formed on the lower surface of the substrate.
  • Another conventional chip-type fuse includes an insulating substrate having a pair of electrodes, a gold (Au) wire wire-­bonded to the electrodes, and a resin which is disposed on the substrate to seal the gold wire.
  • the conventional fuses are very expensive because the recess for housing the conductor must be formed or the wire must be wire-bonded to the electrodes. In addition, the conventional fuses have so complicated shapes that they can not easily automatically mounted on a PCB.
  • a chip-type fuse which includes (1) an insulating member, (2) a pair of electrode members which are made of thin-film metal and disposed on the insulating member, (3) a conducting member which is formed on the upper surface of the insulating membear and electrically connects the pair of electrode members to each other, and (4) a protecting member disposed on the insulating member for protecting the conducting member.
  • Figs. 1 and 2 show a chip-type fuse according to a first embodiment of the invention.
  • a chip-type fuse 1 includes a ceramic substrate 2 as an insulating substrate which is rectangular like a rectangular chip-type resistor and whose size is 3.2mm(l1) x 1.6mm(l2).
  • a conducting member 3 made of thin-film metal which is deposited or printed on upper surface 2a.
  • Conducting member 3 can be made of a silver-­palladium (Pd) alloy, silver-platinum (Pt) alloy, silver, copper, or gold.
  • Electrodes 4a and 4b are formed on side ends 2b and 2c of substrate 2, respectively. Electrodes 4a and 4b are made of thin-film metal which is deposited on side ends 2b and 2c or disposed theron with other known methods.
  • Conducting member 3 is a ractangular parallelepiped and both ends 3a and 3b are connected to electrodes 4a and 4b, respectively.
  • Upper surface 2a of substrate 2 is coated with a silicone resin film (protecting film) 5 to completely cover conducting member 3.
  • chip-type fuse 1 Since chip-type fuse 1 has the same shape as micro-chip resistors, it can be easily automatically mounted on a PCB to perform the mounting cost.
  • fuse 1 The operation of fuse 1 is descrived hereinafter.
  • conducting member 3 If an overcurrent flows through fuse 1, conducting member 3 is melted and broken somewhere between ends 3a and 3b to interrupt the overcurrent. Since conducting member 3 is covered with silicone resin film 5, metal vapor generated at the melted portion are prevented from scattering outside fuse 1. Moreover, arc discharge caused by the metal vapor is prevented from continuing because the silicone resin functions as an arc-­extinguishing medium, completely protecting the electronic parts. In addition, since conducting member 3 is formed directly on upper surface 2a of substrate 2, it has a high heat-radiating effect to allow flows of high-level currents despite the small size of fuse 1.
  • conducting member 3 is not made of a golden wire unlike the conventional chip-type fuse, conducting member 3 is hardly broken, easy to handle, and highly heat-­resistant.
  • Fig. 3 shows a chip-type fuse according to a second embodiment of the invention.
  • a chip-type fuse 11 has a ceramic substrate 12 as an insulating substrate having the size of 3.2mm x 1.6mm which is equal to that of fuse 1 according to the first embodiment.
  • Side ends 12b in the longitudinal direction respectively have semicircular holes 12c which extend through in height.
  • a rectangular conducting member 13 is deposited or printed on an upper surface 12a of substrate 12.
  • Conducting member 13 has trimmed portions 13b which are trimmed with laser light to obtain appropriate resistance.
  • Electrodes 14 are formed on side ends 12b of substrate 12, respectively. Electrodes 14 are made of thin-­film metal as electrodes 4a and 4b described in the first embodiment. Ends 13a of conducting member 13 are connected to electrodes 14.
  • Upper surface 12a of substrate 12 is coated with a silicone resin film (protecting film) 15 to completely cover conducting member 13.
  • chip-type fuse 11 The operation of chip-type fuse 11 is described hereinafter.
  • fuse 11 If an overcurrent flows through fuse 11, one of trimmed portions 13b is melted and broken to interrupt the overcurrent. The reliability of fuse 11 increases because trimmed portions 13b are easily melted and broken by an overcurrent.
  • conducting members 3 and 13 are rectangular in all the embodiments, they can have another shape.
  • protecting films 5 and 15 can be made of a glass material.

Abstract

A chip-type fuse (1) which includes an insulating member (2), a pair of electrode members (4a, 4b) disposed on the insulating member, a conducting member (3) for electrically connecting the pair of electrode members to each other, and a protecting member (5) disposed on the insulating member for protecting the conducting member. The conducting member is deposited or printed on the insulating member. The insulating member is made rectangular so that it can be easily automatically mounted on a printed circuit board.

Description

    BACKGROUND OF THE INVENTION FIELD OF THE INVENTION
  • This invention relates to a chip-type fuse for interrupting overcurrents which damage electronic parts mounted on a printed circuit board (PCB), and more particularly, to an improved chip-­type fuse which is inexpensive and can be easily automatically monted on a PCB.
    • Discussion of the Related Arts
  • Generally, a fuse is used to inrterrupt overcurrents which damage electronic parts mounted on a PCB. For that purpose, chip-­type fuses which are mounted on a PCB have been developed in recent years.
  • One of the conventional chip-type fuses includes an insulating substrate and a conductor. The insulating substrate has two electrodes disposed thereon, and the conductor electrically connects the two electrodes to each other. The conductor is made of thin-film metal and disposed in a recess formed on the lower surface of the substrate.
  • Another conventional chip-type fuse includes an insulating substrate having a pair of electrodes, a gold (Au) wire wire-­bonded to the electrodes, and a resin which is disposed on the substrate to seal the gold wire.
  • The conventional fuses are very expensive because the recess for housing the conductor must be formed or the wire must be wire-bonded to the electrodes. In addition, the conventional fuses have so complicated shapes that they can not easily automatically mounted on a PCB.
    • SUMMARY OF THE INVENTION
  • It is, therefore, an object of this invention to provide a chip-type fuse which can be produced at low cost.
  • It is another object of this invention to provide a chip-­type fuse which can be easily automatically mounted on a PCB.
  • According to this invention, there is provided a chip-type fuse which includes (1) an insulating member, (2) a pair of electrode members which are made of thin-film metal and disposed on the insulating member, (3) a conducting member which is formed on the upper surface of the insulating membear and electrically connects the pair of electrode members to each other, and (4) a protecting member disposed on the insulating member for protecting the conducting member.
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • The above and other objects, advantages and features of this invention will be more fully understood when considered in conjunction with the following figures, of which:
    • Fig.1 is a plan view of a first embodiment of the invention;
    • Fig.2 is a sectional view taken along a line II-II in Fig.1;
    • and Fig.3 is a plan view of a second embodiment of the invention.
    DETAILED DESCRIPTION OF THE INVENTION [ First Embodiment ]
  • Figs. 1 and 2 show a chip-type fuse according to a first embodiment of the invention.
  • A chip-type fuse 1 includes a ceramic substrate 2 as an insulating substrate which is rectangular like a rectangular chip-type resistor and whose size is 3.2mm(l1) x 1.6mm(l2). Formed on an upper surface of ceramic substrate 2 is a conducting member 3 made of thin-film metal which is deposited or printed on upper surface 2a. Conducting member 3 can be made of a silver-­palladium (Pd) alloy, silver-platinum (Pt) alloy, silver, copper, or gold. Electrodes 4a and 4b are formed on side ends 2b and 2c of substrate 2, respectively. Electrodes 4a and 4b are made of thin-film metal which is deposited on side ends 2b and 2c or disposed theron with other known methods. Conducting member 3 is a ractangular parallelepiped and both ends 3a and 3b are connected to electrodes 4a and 4b, respectively. Upper surface 2a of substrate 2 is coated with a silicone resin film (protecting film) 5 to completely cover conducting member 3.
  • Since chip-type fuse 1 has the same shape as micro-chip resistors, it can be easily automatically mounted on a PCB to reduse the mounting cost.
  • The operation of fuse 1 is descrived hereinafter.
  • If an overcurrent flows through fuse 1, conducting member 3 is melted and broken somewhere between ends 3a and 3b to interrupt the overcurrent. Since conducting member 3 is covered with silicone resin film 5, metal vapor generated at the melted portion are prevented from scattering outside fuse 1. Moreover, arc discharge caused by the metal vapor is prevented from continuing because the silicone resin functions as an arc-­extinguishing medium, completely protecting the electronic parts. In addition, since conducting member 3 is formed directly on upper surface 2a of substrate 2, it has a high heat-radiating effect to allow flows of high-level currents despite the small size of fuse 1.
  • On the other hand, since conducting member 3 is not made of a golden wire unlike the conventional chip-type fuse, conducting member 3 is hardly broken, easy to handle, and highly heat-­resistant.
    • [ Second Embodiment ]
  • Fig. 3 shows a chip-type fuse according to a second embodiment of the invention.
  • A chip-type fuse 11 has a ceramic substrate 12 as an insulating substrate having the size of 3.2mm x 1.6mm which is equal to that of fuse 1 according to the first embodiment. Side ends 12b in the longitudinal direction respectively have semicircular holes 12c which extend through in height.
  • A rectangular conducting member 13 is deposited or printed on an upper surface 12a of substrate 12. Conducting member 13 has trimmed portions 13b which are trimmed with laser light to obtain appropriate resistance. Electrodes 14 are formed on side ends 12b of substrate 12, respectively. Electrodes 14 are made of thin-­film metal as electrodes 4a and 4b described in the first embodiment. Ends 13a of conducting member 13 are connected to electrodes 14. Upper surface 12a of substrate 12 is coated with a silicone resin film (protecting film) 15 to completely cover conducting member 13.
  • The operation of chip-type fuse 11 is described hereinafter.
  • If an overcurrent flows through fuse 11, one of trimmed portions 13b is melted and broken to interrupt the overcurrent. The reliability of fuse 11 increases because trimmed portions 13b are easily melted and broken by an overcurrent.
  • Although conducting members 3 and 13 are rectangular in all the embodiments, they can have another shape. Moreover, protecting films 5 and 15 can be made of a glass material.
  • The above description and the accompanying drawings are merely illustrative of the application of the principles of the present invention and are not limiting. Numerous other arrangement which employ the principles of the invention and which fall within its spirits and scope may be readily devised by those skilled in the art. Accordingly, the invention is not limited by the foregoing description, but only limited by the scope of the appended claims.

Claims (7)

1. A chip-type fuse comprising:
an insulating member;
a pair of electrode members which are made of thin-film metal and disposed on said insulating member;
a conducting member which is formed on the upper surface of said insulating member and electrically connects said pair of electrode members to each other; and
a protecting member disposed on said insulating member for protecting said conducting member.
2. The fuse as in Claim 1, wherein said insulating member is a rectangular parallelepiped.
3. The fuse as in Claim 1, wherein said insulating member is made of a ceramic material.
4. The fuse as in Claim 1, wherein said protecting member is made of a silicone resin material.
5. The fuse as in Claim 1, wherein said protecting member is made of a glass material.
6. The fuse as in Claim 1, wherein said conducting member is rectangular.
7. The fuse as in Claim 1, wherein said conducting member includes a trimmed portion which is easily melted and broken by an overcurrent.
EP87117577A 1986-12-01 1987-11-27 Chip-type fuse Expired - Lifetime EP0270954B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AT87117577T ATE89435T1 (en) 1986-12-01 1987-11-27 CHIP SECURITY.

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP287081/86 1986-12-01
JP61287081A JPH0831303B2 (en) 1986-12-01 1986-12-01 Chip type fuse

Publications (2)

Publication Number Publication Date
EP0270954A1 true EP0270954A1 (en) 1988-06-15
EP0270954B1 EP0270954B1 (en) 1993-05-12

Family

ID=17712806

Family Applications (1)

Application Number Title Priority Date Filing Date
EP87117577A Expired - Lifetime EP0270954B1 (en) 1986-12-01 1987-11-27 Chip-type fuse

Country Status (5)

Country Link
EP (1) EP0270954B1 (en)
JP (1) JPH0831303B2 (en)
AT (1) ATE89435T1 (en)
DE (1) DE3785835T2 (en)
ES (1) ES2046194T3 (en)

Cited By (50)

* Cited by examiner, † Cited by third party
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EP0314895A1 (en) * 1987-11-03 1989-05-10 Schurter AG Fuse element
DE4112076A1 (en) * 1990-05-10 1991-11-14 Soc Corp CHIP MELT SAFETY WITH VARIABLE TIME / CURRENT CHARACTERISTICS
GB2255455A (en) * 1991-04-22 1992-11-04 Electronic Components Ltd Fuse
WO1993017442A1 (en) * 1992-02-28 1993-09-02 Avx Corporation Thin film surface mount fuses
DE4223621C1 (en) * 1992-07-17 1993-10-21 Siemens Ag HF fuse for HF current circuit e.g. in NMR tomography - has fuse conductor and end terminals of different cross-section provided by printed circuit
EP0581428A1 (en) * 1992-07-16 1994-02-02 Sumitomo Wiring Systems, Ltd. Card type fuse and method of producing the same
EP0626714A1 (en) * 1993-05-28 1994-11-30 Telefonaktiebolaget Lm Ericsson Method of manufacturing a printed board fuse and a fuse produced by the method
WO1995033276A1 (en) * 1994-05-27 1995-12-07 Littelfuse, Inc. Surface-mounted fuse device
DE29616063U1 (en) * 1996-09-14 1996-10-31 Wickmann Werke Gmbh Electrical fuse
US5586014A (en) * 1994-04-28 1996-12-17 Rohm Co., Ltd. Fuse arrangement and capacitor containing a fuse
WO1996041359A1 (en) * 1995-06-07 1996-12-19 Littelfuse, Inc. Improved method and apparatus for a surface-mounted fuse device
WO1997047019A2 (en) * 1996-06-07 1997-12-11 Littelfuse, Inc. A surface-mount fuse and the manufacture thereof
EP0815577A1 (en) * 1995-03-07 1998-01-07 Caddock Electronics, Inc. Fault current fusing resistor and method
US5790008A (en) * 1994-05-27 1998-08-04 Littlefuse, Inc. Surface-mounted fuse device with conductive terminal pad layers and groove on side surfaces
WO1998037564A2 (en) * 1997-02-21 1998-08-27 Littelfuse, Inc. A surface-mount fuse and the manufacture thereof
US5974661A (en) * 1994-05-27 1999-11-02 Littelfuse, Inc. Method of manufacturing a surface-mountable device for protection against electrostatic damage to electronic components
US6191928B1 (en) 1994-05-27 2001-02-20 Littelfuse, Inc. Surface-mountable device for protection against electrostatic damage to electronic components
DE10005836A1 (en) * 2000-02-10 2001-08-23 Vossloh Schwabe Elektronik Electrical or electronic device, e.g. voltage adapter for lamp, has circuit board carrying conductor to be protected with reduced cross-section burn-through region
WO2002103735A1 (en) * 2001-06-11 2002-12-27 Wickmann-Werke Gmbh Fuse component
US6710699B2 (en) * 2001-07-02 2004-03-23 Abb Research Ltd Fusible link
US6878004B2 (en) 2002-03-04 2005-04-12 Littelfuse, Inc. Multi-element fuse array
WO2005039256A1 (en) * 2003-10-17 2005-04-28 Koninklijke Philips Electronics N.V. Printed circuit board including a fuse
WO2009086496A2 (en) * 2007-12-29 2009-07-09 Cooper Technologies Company Manufacturability of smd and through-hole fuses using laser process
US7843308B2 (en) 2002-04-08 2010-11-30 Littlefuse, Inc. Direct application voltage variable material
US8114383B2 (en) 2003-08-06 2012-02-14 Gruenenthal Gmbh Abuse-proofed dosage form
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US9636303B2 (en) 2010-09-02 2017-05-02 Gruenenthal Gmbh Tamper resistant dosage form comprising an anionic polymer
US9655853B2 (en) 2012-02-28 2017-05-23 Grünenthal GmbH Tamper-resistant dosage form comprising pharmacologically active compound and anionic polymer
US9675610B2 (en) 2002-06-17 2017-06-13 Grünenthal GmbH Abuse-proofed dosage form
US9737490B2 (en) 2013-05-29 2017-08-22 Grünenthal GmbH Tamper resistant dosage form with bimodal release profile
US9750701B2 (en) 2008-01-25 2017-09-05 Grünenthal GmbH Pharmaceutical dosage form
US9852868B2 (en) 2012-09-28 2017-12-26 Kamaya Electric Co., Ltd. Chip fuse and manufacturing method therefor
US9855263B2 (en) 2015-04-24 2018-01-02 Grünenthal GmbH Tamper-resistant dosage form with immediate release and resistance against solvent extraction
US9872835B2 (en) 2014-05-26 2018-01-23 Grünenthal GmbH Multiparticles safeguarded against ethanolic dose-dumping
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US9925146B2 (en) 2009-07-22 2018-03-27 Grünenthal GmbH Oxidation-stabilized tamper-resistant dosage form
US10058548B2 (en) 2003-08-06 2018-08-28 Grünenthal GmbH Abuse-proofed dosage form
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US10729658B2 (en) 2005-02-04 2020-08-04 Grünenthal GmbH Process for the production of an abuse-proofed dosage form
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JPH0433230A (en) * 1990-05-29 1992-02-04 Mitsubishi Materials Corp Chip type fuse
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US5929741A (en) * 1994-11-30 1999-07-27 Hitachi Chemical Company, Ltd. Current protector
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US7983024B2 (en) 2007-04-24 2011-07-19 Littelfuse, Inc. Fuse card system for automotive circuit protection
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Cited By (73)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0314895A1 (en) * 1987-11-03 1989-05-10 Schurter AG Fuse element
DE4112076A1 (en) * 1990-05-10 1991-11-14 Soc Corp CHIP MELT SAFETY WITH VARIABLE TIME / CURRENT CHARACTERISTICS
GB2255455A (en) * 1991-04-22 1992-11-04 Electronic Components Ltd Fuse
WO1993017442A1 (en) * 1992-02-28 1993-09-02 Avx Corporation Thin film surface mount fuses
EP0581428A1 (en) * 1992-07-16 1994-02-02 Sumitomo Wiring Systems, Ltd. Card type fuse and method of producing the same
US5309625A (en) * 1992-07-16 1994-05-10 Sumitomo Wiring Systems, Ltd. Card type fuse and method of producing the same
DE4223621C1 (en) * 1992-07-17 1993-10-21 Siemens Ag HF fuse for HF current circuit e.g. in NMR tomography - has fuse conductor and end terminals of different cross-section provided by printed circuit
US5332990A (en) * 1992-07-17 1994-07-26 Siemens Aktiengesellschaft High-frequency safety fuse
EP0626714A1 (en) * 1993-05-28 1994-11-30 Telefonaktiebolaget Lm Ericsson Method of manufacturing a printed board fuse and a fuse produced by the method
US5543774A (en) * 1993-05-28 1996-08-06 Telefonaktiebolaget Ericsson Method and a device for protecting a printed circuit board against overcurrents
US5586014A (en) * 1994-04-28 1996-12-17 Rohm Co., Ltd. Fuse arrangement and capacitor containing a fuse
US5974661A (en) * 1994-05-27 1999-11-02 Littelfuse, Inc. Method of manufacturing a surface-mountable device for protection against electrostatic damage to electronic components
US5552757A (en) * 1994-05-27 1996-09-03 Littelfuse, Inc. Surface-mounted fuse device
WO1995033276A1 (en) * 1994-05-27 1995-12-07 Littelfuse, Inc. Surface-mounted fuse device
US6191928B1 (en) 1994-05-27 2001-02-20 Littelfuse, Inc. Surface-mountable device for protection against electrostatic damage to electronic components
US6023028A (en) * 1994-05-27 2000-02-08 Littelfuse, Inc. Surface-mountable device having a voltage variable polgmeric material for protection against electrostatic damage to electronic components
US5790008A (en) * 1994-05-27 1998-08-04 Littlefuse, Inc. Surface-mounted fuse device with conductive terminal pad layers and groove on side surfaces
US5943764A (en) * 1994-05-27 1999-08-31 Littelfuse, Inc. Method of manufacturing a surface-mounted fuse device
US5844477A (en) * 1994-05-27 1998-12-01 Littelfuse, Inc. Method of protecting a surface-mount fuse device
EP0815577A4 (en) * 1995-03-07 1999-06-23 Caddock Electronics Inc Fault current fusing resistor and method
CN1084923C (en) * 1995-03-07 2002-05-15 卡杜克电子有限公司 Fault current fusing resistor and method
EP0815577A1 (en) * 1995-03-07 1998-01-07 Caddock Electronics, Inc. Fault current fusing resistor and method
WO1996041359A1 (en) * 1995-06-07 1996-12-19 Littelfuse, Inc. Improved method and apparatus for a surface-mounted fuse device
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ATE89435T1 (en) 1993-05-15
DE3785835D1 (en) 1993-06-17
JPS63141233A (en) 1988-06-13
ES2046194T3 (en) 1994-02-01
JPH0831303B2 (en) 1996-03-27
EP0270954B1 (en) 1993-05-12
DE3785835T2 (en) 1993-08-19

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